|Other Names||Heat shock factor protein 1, HSF 1, Heat shock transcription factor 1, HSTF 1, HSF1, HSTF1|
|Target/Specificity||The synthetic peptide sequence used to generate the antibody AP2501a is PLVRVKEEPPSPPQSPR, containing a predicted sumoylation site from the central region of human HSF1. A 10 to 100 fold molar excess to antibody is recommended. Precise conditions should be optimized for a particular assay.|
|Format||The synthetic peptide was lyophilized with 100% acetonitrile and is supplied as a powder. Reconstitute with 0.1 ml deionized water for a final concentration of 1 mg/ml.|
|Storage||Maintain refrigerated at 2-8°C for up to 6 months. For long term storage store at -20°C.|
|Precautions||This product is for research use only. Not for use in diagnostic or therapeutic procedures.|
|Function||DNA-binding protein that specifically binds heat shock promoter elements (HSE) and activates transcription. In higher eukaryotes, HSF is unable to bind to the HSE unless the cells are heat shocked.|
|Cellular Location||Cytoplasm. Nucleus. Note=Cytoplasmic during normal growth. On activation, translocates to nuclear stress granules. Colocalizes with SUMO1 in nuclear stress granules|
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Provided below are standard protocols that you may find useful for product applications.
Heat shock transcription factor 1 (HSF1) mediates the induction of heat shock protein gene expression in cells exposed to elevated temperature and other stress conditions. In response to stress, HSF1 acquires DNA-binding ability and localizes to nuclear stress granules. SUMO modification of HSF1 converts HSF1 to the DNA-binding form. HSF1 colocalizes with SUMO-1 in nuclear stress granules, which is prevented by mutation of the HSF1 lysine targeted for sumoylation.
Hilgarth, et al., Biochem Biophys Res Commun. 2003 Mar 28;303(1):196-200.He, H., et al., J. Biol. Chem. 278(37):35465-35475 (2003).Wang, X., et al., Mol. Cell. Biol. 23(17):6013-6026 (2003).Ignatenko, N.A., et al., Exp. Cell Res. 288(1):1-8 (2003).Soncin, F., et al., Biochem. Biophys. Res. Commun. 303(2):700-706 (2003).
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